Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink

Michael Ozeh; A. G. Agwu Nnanna

doi:10.1115/IPACK2018-8354

Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Electronic)	9780791851920
DOIs	https://doi.org/10.1115/IPACK2018-8354
State	Published - 2018
Externally published	Yes
Event	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 - San Francisco, United States Duration: Aug 27 2018 → Aug 30 2018

Publication series

Name	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018

Conference

Conference	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
Country/Territory	United States
City	San Francisco
Period	8/27/18 → 8/30/18

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Hardware and Architecture

Access to Document

10.1115/IPACK2018-8354

Cite this

Ozeh, M., & Agwu Nnanna, A. G. (2018). Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink. In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IPACK2018-8354

Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink. / Ozeh, Michael; Agwu Nnanna, A. G.
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018. American Society of Mechanical Engineers (ASME), 2018. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ozeh, M & Agwu Nnanna, AG 2018, Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink. in ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, American Society of Mechanical Engineers (ASME), ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, San Francisco, United States, 8/27/18. https://doi.org/10.1115/IPACK2018-8354

Ozeh M, Agwu Nnanna AG. Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink. In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018. American Society of Mechanical Engineers (ASME). 2018. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018). doi: 10.1115/IPACK2018-8354

Ozeh, Michael ; Agwu Nnanna, A. G. / Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018. American Society of Mechanical Engineers (ASME), 2018. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018).

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Waste heat recovery for powering mobile devices using thermoelectric generators and evaporatively-cooled heat sink

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

Other files and links

Cite this