Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study

A. G. Agwu Nnanna; Dereje Agonafer; Mark T. North

Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study

A. G. Agwu Nnanna, Dereje Agonafer, Mark T. North

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Pages	1763-1768
Number of pages	6
State	Published - 2001
Externally published	Yes
Event	Advances in Electronic Packaging - Kauai, Hi, United States Duration: Jul 8 2001 → Jul 13 2001

Publication series

Name	Advances in Electronic Packaging
Volume	3

Conference

Conference	Advances in Electronic Packaging
Country/Territory	United States
City	Kauai, Hi
Period	7/8/01 → 7/13/01

ASJC Scopus Subject Areas

General Engineering
Electrical and Electronic Engineering

Cite this

Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study. / Agwu Nnanna, A. G.; Agonafer, Dereje; North, Mark T.
Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging. 2001. p. 1763-1768 (Advances in Electronic Packaging; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Agwu Nnanna, AG, Agonafer, D & North, MT 2001, Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study. in Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging. Advances in Electronic Packaging, vol. 3, pp. 1763-1768, Advances in Electronic Packaging, Kauai, Hi, United States, 7/8/01.

@inproceedings{e6e3afdc78b741ce922977dac8b2ea29,

title = "Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study",

author = "{Agwu Nnanna}, {A. G.} and Dereje Agonafer and North, {Mark T.}",

year = "2001",

language = "English",

isbn = "0791835405",

series = "Advances in Electronic Packaging",

pages = "1763--1768",

booktitle = "Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging",

note = "Advances in Electronic Packaging ; Conference date: 08-07-2001 Through 13-07-2001",

}

TY - GEN

T1 - Optimization of heat pipe spacing in heat sinks

T2 - Advances in Electronic Packaging

AU - Agwu Nnanna, A. G.

AU - Agonafer, Dereje

AU - North, Mark T.

PY - 2001

Y1 - 2001

UR - http://www.scopus.com/inward/record.url?scp=0348198909&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0348198909&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0348198909

SN - 0791835405

SN - 9780791835401

T3 - Advances in Electronic Packaging

SP - 1763

EP - 1768

BT - Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging

Y2 - 8 July 2001 through 13 July 2001

ER -

Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study

Publication series

Conference

ASJC Scopus Subject Areas

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Cite this