Low voltage electrohydrodynamic micropump for cooling of electronic device

Comlan Fandohan; A. G.Agwu Nnanna

doi:10.1115/imece2011-64830

Low voltage electrohydrodynamic micropump for cooling of electronic device

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Nano and Micro Materials, Devices and Systems; Microsystems Integration
Publisher	American Society of Mechanical Engineers (ASME)
Pages	785-791
Number of pages	7
ISBN (Print)	9780791854976
DOIs	https://doi.org/10.1115/imece2011-64830
State	Published - 2011
Externally published	Yes
Event	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011 - Denver, CO, United States Duration: Nov 11 2011 → Nov 17 2011

Publication series

Name	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Volume	11

Conference

Conference	ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011
Country/Territory	United States
City	Denver, CO
Period	11/11/11 → 11/17/11

ASJC Scopus Subject Areas

Mechanical Engineering

Access to Document

10.1115/imece2011-64830

Cite this

Fandohan, C., & Nnanna, A. G. A. (2011). Low voltage electrohydrodynamic micropump for cooling of electronic device. In Nano and Micro Materials, Devices and Systems; Microsystems Integration (pp. 785-791). (ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011; Vol. 11). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/imece2011-64830

Low voltage electrohydrodynamic micropump for cooling of electronic device. / Fandohan, Comlan; Nnanna, A. G.Agwu.
Nano and Micro Materials, Devices and Systems; Microsystems Integration. American Society of Mechanical Engineers (ASME), 2011. p. 785-791 (ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011; Vol. 11).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fandohan, C & Nnanna, AGA 2011, Low voltage electrohydrodynamic micropump for cooling of electronic device. in Nano and Micro Materials, Devices and Systems; Microsystems Integration. ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, vol. 11, American Society of Mechanical Engineers (ASME), pp. 785-791, ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, Denver, CO, United States, 11/11/11. https://doi.org/10.1115/imece2011-64830

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Low voltage electrohydrodynamic micropump for cooling of electronic device

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

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