Laser-assisted via hole metallization in PCB materials

K. Kordás; J. Békési; R. Vajtai; M. Jauhianen; J. Remes; A. Uusimäki; S. Leppävuori; Thomas F. George; L. Nánai

doi:10.1007/S11664-001-0099-7

Laser-assisted via hole metallization in PCB materials

K. Kordás
, J. Békési
, R. Vajtai
, M. Jauhianen
, J. Remes
, A. Uusimäki
, S. Leppävuori
, Thomas F. George
, L. Nánai

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Journal of Electronic Materials
Volume	30
DOIs	https://doi.org/10.1007/S11664-001-0099-7
State	Published - May 1 2001
Externally published	Yes

Disciplines

Analytical Chemistry

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@article{f0d4328aa927477b9932141ab7a37d74,

title = "Laser-assisted via hole metallization in PCB materials",

author = "K. Kord{\'a}s and J. B{\'e}k{\'e}si and R. Vajtai and M. Jauhianen and J. Remes and A. Uusim{\"a}ki and S. Lepp{\"a}vuori and George, \{Thomas F.\} and L. N{\'a}nai",

note = "A novel via hole metallization method is presented, where the vias are drilled in polyimide/copper (PI/Cu) flexible printed circuit boards (PCBs) using KrF excimer pulses, and then pre-metallized using a scanned Ar+ laser.",

year = "2001",

month = may,

day = "1",

doi = "10.1007/S11664-001-0099-7",

language = "American English",

volume = "30",

journal = "Journal of Electronic Materials",

}

TY - JOUR

T1 - Laser-assisted via hole metallization in PCB materials

AU - Kordás, K.

AU - Békési, J.

AU - Vajtai, R.

AU - Jauhianen, M.

AU - Remes, J.

AU - Uusimäki, A.

AU - Leppävuori, S.

AU - George, Thomas F.

AU - Nánai, L.

N1 - A novel via hole metallization method is presented, where the vias are drilled in polyimide/copper (PI/Cu) flexible printed circuit boards (PCBs) using KrF excimer pulses, and then pre-metallized using a scanned Ar+ laser.

PY - 2001/5/1

Y1 - 2001/5/1

UR - https://hungary.pure.elsevier.com/en/publications/laser-assisted-via-hole-metallization-in-pcb-materials

U2 - 10.1007/S11664-001-0099-7

DO - 10.1007/S11664-001-0099-7

M3 - Article

VL - 30

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

ER -

Laser-assisted via hole metallization in PCB materials

Disciplines

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