Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces

A. G. Agwu Nnanna; A. Haji-Sheikh; D. Agonafer

Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces

A. G. Agwu Nnanna, A. Haji-Sheikh, D. Agonafer

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	292-297
Number of pages	6
State	Published - 2002
Externally published	Yes
Event	8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States Duration: May 30 2002 → Jun 1 2002

Conference

Conference	8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
Country/Territory	United States
City	San Diego, CA
Period	5/30/02 → 6/1/02

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Keywords

Electronic cooling and packaging
Fin geometry and curvature
Heat Sink
Variable heat transfer coefficient

Cite this

Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces. / Agwu Nnanna, A. G.; Haji-Sheikh, A.; Agonafer, D.
2002. 292-297 Paper presented at 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, San Diego, CA, United States.

Research output: Contribution to conference › Paper › peer-review

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title = "Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces",

keywords = "Electronic cooling and packaging, Fin geometry and curvature, Heat Sink, Variable heat transfer coefficient",

author = "{Agwu Nnanna}, {A. G.} and A. Haji-Sheikh and D. Agonafer",

year = "2002",

language = "English",

pages = "292--297",

note = "8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems ; Conference date: 30-05-2002 Through 01-06-2002",

}

TY - CONF

T1 - Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces

AU - Agwu Nnanna, A. G.

AU - Haji-Sheikh, A.

AU - Agonafer, D.

PY - 2002

Y1 - 2002

KW - Electronic cooling and packaging

KW - Fin geometry and curvature

KW - Heat Sink

KW - Variable heat transfer coefficient

UR - http://www.scopus.com/inward/record.url?scp=0036459758&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036459758&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0036459758

SP - 292

EP - 297

T2 - 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems

Y2 - 30 May 2002 through 1 June 2002

ER -

Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces

Conference

ASJC Scopus Subject Areas

Keywords

Other files and links

Cite this