| Original language | English |
|---|---|
| Pages (from-to) | 18-27 |
| Number of pages | 10 |
| Journal | Applied Thermal Engineering |
| Volume | 26 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2006 |
| Externally published | Yes |
ASJC Scopus Subject Areas
- Energy Engineering and Power Technology
- Industrial and Manufacturing Engineering
Keywords
- Electronics cooling
- High heat flux electronics, and evaporator cold plate
- TXV
- Vapor compression refrigeration system