An integrated thermoelectric nanofluid heat exchanger

William Rutherford, Wessam Elomar, A. G.Agwu Nnanna, Brian Sankowski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages581-587
Number of pages7
DOIs
StatePublished - 2007
Externally publishedYes
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: Jul 8 2007Jul 12 2007

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume2

Conference

ConferenceASME Electronic and Photonics Packaging Division
Country/TerritoryUnited States
CityVancouver, BC
Period7/8/077/12/07

ASJC Scopus Subject Areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

Keywords

  • Coefficient of performance
  • Experiments
  • Heat exchanger
  • Integrated circuit heat transfer
  • Nanofluids
  • Thermal resistance
  • Thermoelectric

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